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US Patent Issued to Sandisk Technologies on April 14 for "Trench patterning process using microcracking" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,474, issued on April 14, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Trench patterning process using microcracking" was... Read More


US Patent Issued to Sandisk Technologies on April 14 for "Trench patterning process using microcracking" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,474, issued on April 14, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Trench patterning process using microcracking" was... Read More


US Patent Issued to United Microelectronics on April 14 for "Memory structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,475, issued on April 14, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan). "Memory structure and manufacturing method there... Read More


US Patent Issued to United Microelectronics on April 14 for "Memory structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,475, issued on April 14, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan). "Memory structure and manufacturing method there... Read More


US Patent Issued to MACRONIX INTERNATIONAL on April 14 for "Memory device and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,476, issued on April 14, was assigned to MACRONIX INTERNATIONAL Co. LTD. (Hsinchu, Taiwan). "Memory device and manufacturing method thereo... Read More


US Patent Issued to MACRONIX INTERNATIONAL on April 14 for "Memory device and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,476, issued on April 14, was assigned to MACRONIX INTERNATIONAL Co. LTD. (Hsinchu, Taiwan). "Memory device and manufacturing method thereo... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor device with conductive layers in isolation structures" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,477, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device with conductive layer... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor device with conductive layers in isolation structures" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,477, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device with conductive layer... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor memory device and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,478, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor memory device and electronic... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor memory device and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,478, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor memory device and electronic... Read More